4. Electrical generator or motor structure
  5. Non-dynamoelectric
  6. Piezoelectric elements and devices

James E. Kohl

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Compliant, solderable input/output bump structures

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Compliant, solderable input/output bump structures

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Control circuitry for high voltage solid-state switches

Electrical transmission or interconnection systems – Nonlinear reactor systems – Parametrons
Patent

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Electroless metal connection structures and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Field shields for Schottky barrier devices

Patent

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Profile ID: LFUS-PAI-P-472424

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