4. Chemistry: electrical and wave energy
  5. Apparatus
  6. Electrolytic

James E. Fluegel

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Copper seed layer repair technique using electroless touch-up

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly semiconductor substrate
Reexamination Certificate

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Electroplated copper interconnection structure, process for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Electroplating apparatus and method using a compressible...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Contacting coating as it forms with solid member or material...
Reexamination Certificate

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Manufacturable CoWP metal cap process for copper interconnects

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Manufacturable CoWP metal cap process for copper interconnects

Compositions – Electrically conductive or emissive compositions – Metal compound containing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1708189

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