Manufacturable CoWP metal cap process for copper interconnects

Details Manufacturable CoWP metal cap process for copper interconnects Manufacturable CoWP metal cap process for copper interconnects

2007-05-22

2008-08-05

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

Metal compound containing

C252S521600, C423S022000, C423S491000

Reexamination Certificate

active

07407605

ABSTRACT:
An aqueous seeding solution of palladium acetate, acetic acid and chloride.

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