4. Metal fusion bonding
  5. Process
  6. With measuring, testing, indicating, inspecting, or...

James D. Bielick

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Heat dissipation apparatus and method for attaching a heat dissi

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Heat dissipation apparatus and method for attaching a heat dissi

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Heat dissipation apparatus and method for attaching a heat...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Heatsink and package structures with fusible release layer

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Method of performing solder joint analysis of semi-conductor com

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent

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Profile ID: LFUS-PAI-P-852031

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