Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-01-23
1999-05-18
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361704, 361707, 361708, 361717, 361718, 361719, 257706, 257707, 257712, 257713, 257717, 165 803, H05K7/20
Patent
active
059056363
ABSTRACT:
An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.
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patent: 5459352 (1995-10-01), Layton et al.
patent: 5587882 (1996-12-01), Patel
patent: 5744863 (1998-04-01), Culnane et al.
R. C. Chu et al., "Thermal Interface", IBM Technical Disclosure Bulletin, vol. 20, No. 2, Jul. 1977, p.680.
Baska Douglas A.
Becker Darryl J.
Bielick James D.
Isaacs Phillip D.
Zumbrunnen Michael L.
Chervinsky Boris L.
International Business Machines - Corporation
Picard Leo P.
Russell Brian F.
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