Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
1999-01-04
2001-07-17
Gallagher, John J. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S314000, C156S319000, C165S080200, C165S138000
Reexamination Certificate
active
06261404
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates in general to thermal management of electronic devices and in particular to a heat dissipation apparatus for an electronic device. Still more particularly, the present invention relates to a heat sink apparatus and method for attaching the heat sink apparatus to an electronic device, wherein the heat sink apparatus is mechanically attached to the electronic device by adhesive and thermally coupled to the electronic device by a thermally conductive material.
2. Description of the Related Art
As the performance requirements for computers and other electronic equipment increase, the integrated circuit (IC) components comprising the electronic equipment operate at higher power and are manufactured at increased device densities. As a result, greater emphasis is being placed on the utilization of heat sinks and other means for managing the thermal environment of the IC components.
A conventional package for an IC chip includes a substrate to which the chip is electrically connected and a cap which seals the chip within the package. In addition, the package typically includes a thermal paste sandwiched between the cap and the upper chip surface which conducts heat from the chip to the cap. Packages for high-power chips often utilize a heat sink attached to the package cap to enhance the efficiency of heat transfer from the package cap to the surrounding environment, thereby maintaining the temperature of the chip within the recommended operating temperature range.
As will be appreciated by those skilled in the art, heat sinks can be attached to IC packages by a variety of means, including clamps, screws, and other hardware, as well as thermally conductive adhesives. Because of the package-dependence of clamp or screw-mounted heat sinks and the additional labor required to attach clamp and screw-mounted heat sinks to packages, electronic device manufacturers often prefer utilizing adhesive-mounted heat sinks in order to minimize production costs. However, because materials having desirable adhesive properties typically do not have a high thermal conductivity, it is difficult to provide a high performance heat sink at a low cost.
Consequently, it would be desirable to provide an improved heat sink apparatus and method for attaching a heat sink apparatus to an electronic device which enable a high thermal performance heat sink apparatus to be assembled with minimal labor utilizing low-cost materials.
SUMMARY OF THE INVENTION
It is therefore one object of the present invention to provide an improved method and apparatus for thermal management of an electronic device.
It is another object of the present invention to provide an improved heat dissipation apparatus for an electronic device.
It is yet another object of the present invention to provide an improved heat sink apparatus and method for attaching the heat sink apparatus to an electronic device, wherein the heat sink apparatus and electronic device are mechanically attached by adhesive and thermally coupled by a thermally conductive material.
The foregoing objects are achieved as is now described. An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.
The above as well as additional objects, features, and advantages of the present invention will become apparent in the following detailed written description.
REFERENCES:
patent: 725094 (1903-04-01), Kimberlin
patent: 2015806 (1935-10-01), Menger
patent: 4403102 (1983-09-01), Jordan et al.
patent: 4567505 (1986-01-01), Pease et al.
patent: 4620215 (1986-10-01), Lee
patent: 4763225 (1988-08-01), Prenkel et al.
patent: 4915167 (1990-04-01), Altoz
patent: 5049981 (1991-09-01), Dahringer
patent: 5057909 (1991-10-01), Mok et al.
patent: 5109317 (1992-04-01), Miyamoto et al.
patent: 5126829 (1992-06-01), Daikoju et al.
patent: 5276586 (1994-01-01), Hatsuda et al.
patent: 5459352 (1995-10-01), Layton et al.
patent: 5587882 (1996-12-01), Patel
patent: 5623394 (1997-04-01), Sherif et al.
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5870286 (1999-02-01), Butterbaugh et al.
patent: 5903436 (1999-05-01), Brownell et al.
patent: 5963428 (1999-10-01), Salmonson et al.
R. C. Chu et al, “Thermal Interface,” IBM Technical Disclosure Bulletin, vol. 20, No. 2, Jul. 1977, p. 680.
Baska Douglas A.
Becker Darryl J.
Bielick James D.
Isaacs Phillip D.
Zumbrunnen Michael L.
Bracewell & Patterson LLP
Gallagher John J.
International Business Machines - Corporation
LandOfFree
Heat dissipation apparatus and method for attaching a heat... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation apparatus and method for attaching a heat..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation apparatus and method for attaching a heat... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2563379