Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-12-09
2000-07-04
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361704, 361706, 361707, 361708, 361709, 361717, 361718, 361719, 257706, 257707, 257717, 257722, 165 803, 174 163, H05K 720
Patent
active
060847751
ABSTRACT:
Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC modules or banks of IC modules that are interconnected to a printed circuit card. A mechanically compliant, thermally conductive adhesive is used to join the heatsinks to the modules. An oxide formed on the release layer readily bonds with the thermally conductive adhesive. In the event that heatsinks need to be removed to repair or rework the modules, local heat may be applied to melt the release layer to remove a heatsink without need for use of significant applied torque and normal forces. Because the release layer has a low melting point that affords easy separation from the adhesive layer, both component delaminations and the partial reflow or melting of solder joints on adjacent components are eliminated from the heatsink removal process.
REFERENCES:
patent: 3686539 (1972-08-01), Schwartzman
patent: 3996548 (1976-12-01), Chaffin, III
patent: 4034469 (1977-07-01), Koopman et al.
patent: 4817854 (1989-04-01), Tihanyi et al.
patent: 5012858 (1991-05-01), Natori et al.
patent: 5247203 (1993-09-01), Shigihara et al.
patent: 5396403 (1995-03-01), Patel
patent: 5422788 (1995-06-01), Heinen et al.
patent: 5430611 (1995-07-01), Patel et al.
patent: 5587882 (1996-12-01), Patel
patent: 5601675 (1997-02-01), Hoffmeyer et al.
patent: 5724729 (1998-03-01), Sherif et al.
patent: 5769989 (1998-06-01), Hoffmeyer et al.
patent: 5821612 (1998-10-01), Kitagawa
patent: 5907474 (1999-05-01), Dolbear
patent: 5912805 (1999-06-01), Freuler et al.
Bartley Gerald K.
Baska Douglas A.
Bielick James D.
Butterbaugh Matthew A.
Hoffmeyer Mark K.
Bradley James E.
Chervinsky Boris G.
International Business Machines - Corporation
Picard Leo P.
LandOfFree
Heatsink and package structures with fusible release layer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heatsink and package structures with fusible release layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heatsink and package structures with fusible release layer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1492173