Method of performing solder joint analysis of semi-conductor com

Details Method of performing solder joint analysis of semi-conductor com Method of performing solder joint analysis of semi-conductor com

1995-04-24

1997-07-29

Bradley, P. Austin

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228103, B23K 119, B23K 3102, B23K 3112

Patent

active

056514930

ABSTRACT:
A method for analyzing solder joint assemblies in devices such as solder bumped silicon chips, ball grid arrays or land grid arrays is disclosed. The method includes applying a dye solution to a device under test and then causing that dye solution to penetrate any interstices between any solder interconnect and the device under test, which also includes penetrating any fractures in any joints or joint failures. Next, the dye is dried or cured so as to provide ready analysis upon the analysis portion of the method. The device under test is then caused to be separated or fractured in such a way that a seam or border of a solder joint or an attachment border may be analyzed to identify any structural failure by visually analyzing where any dye has penetrated such structural failures.

REFERENCES:
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patent: 4621193 (1986-11-01), Van Hoye
patent: 4777901 (1988-10-01), Marsden et al.
Andrew J. Mawer, et al., "Plastic BGA Solder Joint Reliability Considerations", Surface Mount International Conference, Aug. 28, 1994, pp. 239-251.
Metals Handbook, 9th Ed., vol. 6, ASM, Metals Park, OH, Aug. 1983, pp. 847-848.

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