4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Smart card package

Jack Chang Chien

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Method of fabricating a semiconductor package having through...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Method of minimizing kerf width on a semiconductor substrate...

Semiconductor device manufacturing: process – Making regenerative-type switching device – Having structure increasing breakdown voltage
Reexamination Certificate

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Methods of promoting adhesion between transfer molded IC...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Padless substrate for surface mounted components

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Semiconductor package having through holes for molding back...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2279097

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