Method of fabricating a semiconductor package having through...

Details Method of fabricating a semiconductor package having through... Method of fabricating a semiconductor package having through...

2011-05-10

2011-05-10

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257SE21502

Reexamination Certificate

active

07939382

ABSTRACT:
A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.

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