4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Subsequent separation into plural bodies

Irwin Yablok

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Complete device layer transfer without edge exclusion via...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...
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Complete device layer transfer without edge exclusion via...

Metal fusion bonding – Process – Specific mode of heating or applying pressure
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Method for making a semiconductor device having increased...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
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Method of forming silicon on insulator wafers

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
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Methods and apparatuses for manufacturing ultra thin device...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
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Profile ID: LFUS-PAI-P-2410438

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