4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Housing or package filled with solid or liquid electrically...

Imbera Electronics Oy

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Corporate Assignee

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Electronic module with a conductive-pattern layer and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Electronic module with a conductive-pattern layer and a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Heat conduction from an embedded component

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Method for embedding a component in a base

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Method for embedding a component in a base

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2265523

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