Heat conduction from an embedded component

Details Heat conduction from an embedded component Heat conduction from an embedded component

2005-04-27

2011-12-13

Nguyen, Hoa C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C174S265000, C361S676000, C361S701000, C361S702000, C361S712000

Reexamination Certificate

active

08076586

ABSTRACT:
This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

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