Electronic module with a conductive-pattern layer and a...

Details Electronic module with a conductive-pattern layer and a... Electronic module with a conductive-pattern layer and a...

2009-11-16

2011-10-11

Stark, Jarrett (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S618000, C438S118000, C257S723000, C257S783000

Reexamination Certificate

active

08034658

ABSTRACT:
This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.

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