Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2004-03-31
2010-02-16
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23085, C257SE23178, C257SE25011, C257SE23105, C257SE21705, C257S777000, C257S723000, C257S778000, C257S692000, C257S773000, C257S774000
Reexamination Certificate
active
07663215
ABSTRACT:
This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.
REFERENCES:
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4746392 (1988-05-01), Hoppe
patent: 5248852 (1993-09-01), Kumagai
patent: 5306670 (1994-04-01), Mowatt et al.
patent: 5353195 (1994-10-01), Fillion et al.
patent: 5355102 (1994-10-01), Kornrumpf et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5552633 (1996-09-01), Sharma
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6154366 (2000-11-01), Ma et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6284564 (2001-09-01), Balch et al.
patent: 6396148 (2002-05-01), Eichelberger et al.
patent: 6475877 (2002-11-01), Saia et al.
patent: 6701614 (2004-03-01), Ding et al.
patent: 6713859 (2004-03-01), Ma
patent: 6783077 (2004-08-01), Fannasch
patent: 6876072 (2005-04-01), Wang et al.
patent: 2002/0117743 (2002-08-01), Nakatani et al.
patent: 2003/0068852 (2003-04-01), Towle et al.
patent: 2003/0159852 (2003-08-01), Nakamura
patent: 2001-053447 (2001-02-01), None
patent: WO-03/065778 (2003-08-01), None
Palm Petteri
Tuominen Risto
Birch & Stewart Kolasch & Birch, LLP
Imbera Electronics Oy
Williams Alexander O
LandOfFree
Electronic module with a conductive-pattern layer and a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic module with a conductive-pattern layer and a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic module with a conductive-pattern layer and a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4211341