Method for embedding a component in a base

Details Method for embedding a component in a base Method for embedding a component in a base

2007-11-13

2007-11-13

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000, C438S126000, C257SE21500, C257SE23126, C257SE23182, C257SE21511

Reexamination Certificate

active

10502336

ABSTRACT:
This publication discloses a method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it were, manufactured around the semiconductor components. According to the invention, through-holes for the semiconductor components are made in the base, in such a way that the holes extend between the first and second surface of the base. After the making of the holes, a polymer film is spread over the second surface of the base structure, in such a way that the polymer film also covers the through-holes made for the semiconductor components from the side of the second surface of the base structure. Before the hardening, or after the partial hardening of the polymer film, the semiconductor components are placed in the holes made in the base, from the direction of the first surface of the base. The semiconductor components are pressed against the polymer film in such a way that they adhere to the polymer film. After this, the final hardening of the polymer film is carried out.

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Patent Abstracts of Japan, vol. 2002, No. 05, May 3, 2002.

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