4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Hui-Ping Liu

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Chip package without core and stacked chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Chip package without core and stacked chip package structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Lead frame structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Overall equipment effectiveness on-line categories system...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2084645

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