Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
1998-08-07
2001-07-03
Sheikh, Ayaz (Department: 2155)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S083000, C700S095000, C700S096000, C700S100000, C700S108000, C700S111000, C700S213000, C705S007380, C705S002000
Reexamination Certificate
active
06256550
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to processes for control of the process of manufacturing semiconductor chips and more particularly to control of production in an integrated circuit manufacturing process.
2. Description of Related Art
See “Guideline for Definition and Measurement of Equipment Reliability, Availability and Maintainability, SEMI International Standards, SEMI E-10-92, pp 61-69 (1993); and Robert C. Leachman, “Closed-loop Measurement of Equipment Efficiency and Equipment Capacity”, IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 115-126 (1995).
U.S. Pat. No. 5,528,510 of Kraft for “Equipment Performance Apparatus and Method” describes a process control system and a method for yielding improvement in product throughput by using tuned model process control using product and machine parametric data, process control via real time critical equipment transient monitoring, process windowing of critical equipment of equipment transients and machine/product parametric data correlation.
U.S. Pat. No. 5,612,886 of Weng for “Method and System for Dynamic Dispatching in Semiconductor Manufacturing Plants” describes WIP management.
See U.S. Pat. No. 5,402,350 of Kline which shows a method for “Scheduling for Multi-Task Manufacturing Equipment” and U.S. Pat. No. 5,444,632 of Kline et al. for “Apparatus and Method for Controlling and Scheduling Processing Machines”.
SUMMARY OF THE INVENTION
This invention provides the features as follows:
1. Provide a useful metric (set of measurement parameters) for performance analysis.
2. OEE provides an excellent way for chip manufacturers and equipment suppliers to understand and track productivity and find ways to improve it.
3. When OEE is implemented in a manufacturing area, there are major savings in investments related to bottleneck machines.
In accordance with this invention, a manufacturing control and reporting method and system for manufacture of semiconductor devices comprises as follows:
a system for loading a mechanical article handling device in a semiconductor manufacturing system,
means for providing an automatic check-in and changing equipment status to an UP status,
means for automatically checking whether the article handling system is empty, and
means for automatically changing the system status to an IDLE status.
Preferably, the system provides automatic check-in, and
subsequent to processing of the workload by the plant provides track-out followed by automatically checking whether the article handling system is empty,
then the system checking whether a TE has arrived, and
the system checking whether the TE has reloaded the article handling system.
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Robert Leachman “Closed-Loop Measurement of Equipment Efficiency and Equipment CApacity” IEEE p. 115-126 (1995) Advance Semiconductor Manufacturing Conference.*
Guideline for Definition and Measurement of Equipment Reliability Availability and Maintain ability, SEMI International Standard, SEMI E-10-92 p. 61-69 (1993).
Robert C. Leachman, “Closed-Loop Measurement of Equipment Efficiency and Equipment Capacity” IEEEISEMI Advanced Semiconductor Manufacturing Conference, p. 115-126 (1995).
Chen Ching-Ren
Chen Pai-Lan
Hsieh Ming-Hsiu
Liu Hui-Ping
Wu Wen Feng
Ackerman Stephen B.
Jean Frantz B.
Saile George O.
Sheikh Ayaz
Taiwan Semiconductor Manufacturing Company
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