Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Inventor
active
Heat sink bonded to a die paddle having at least one aperture
Method for assembling a heat sink to a die paddle
Method for bonding a heat sink to a die paddle
Method for dispensing underfill and devices formed
Semiconductor package for improving the capability of spreading
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Profile ID: LFUS-PAI-P-41606