Method for assembling a heat sink to a die paddle

Details Method for assembling a heat sink to a die paddle Method for assembling a heat sink to a die paddle

1996-01-30

1998-08-04

Picardat, Kevin

Fishing, trapping, and vermin destroying

437211, 437214, 437219, 437902, H01L 2160

Patent

active

057892709

ABSTRACT:
A method of assembly an integrated circuit die to a heat sink by first providing a lead frame that has a die-attach paddle portion having a top surface, a bottom surface, and an opening therethrough, positioning a heat sink having a raised portion on its top surface abutting the bottom surface of the die-attach paddle portion, and then frictionally engaging the heat sink and the die-attach paddle together and bonding an integrated circuit chip to the top surface of the heat sink with an adhesive material sandwiched therein between such that the assembly can be placed in a mold apparatus for forming a plastic encapsulated package.

REFERENCES:
patent: 5091341 (1992-02-01), Asada et al.
patent: 5147821 (1992-09-01), McShane et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5202288 (1993-04-01), Doering et al.
patent: 5438478 (1995-08-01), Kondo et al.
patent: 5444025 (1995-08-01), Sono et al.
Jian D. Jeng et al., U.S.S.N. 08/594,497, Method For Bonding A Heat Sink To A Die Paddle, Filed: Jan. 31, 1996.
Shailesh Mulgaonker et al., Thermal Performance Limits of The QFP Family, Aug. 1993, Ninth IEEE Semi-Therm Symposium.

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