4. Optics: measuring and testing
  5. Inspection of flaws or impurities
  6. Containers or enclosures

Hsien-Ping Feng

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Apparatus and method for preventing copper peeling in ECP

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate

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Chamber leakage detection by measurement of reflectivity of...

Optics: measuring and testing – Inspection of flaws or impurities – Containers or enclosures
Reexamination Certificate

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Method and apparatus for copper film quality enhancement...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for conductive film quality evaluation

Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate

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Method for preventing voids in metal interconnects

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2918694

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