Apparatus and method for preventing copper peeling in ECP

Details Apparatus and method for preventing copper peeling in ECP Apparatus and method for preventing copper peeling in ECP

2006-08-28

2010-02-23

Chowdhury, Tarifur (Department: 2886)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S445000, C356S630000, C205S084000, C438S007000

Reexamination Certificate

active

07667835

ABSTRACT:
An apparatus and method for preventing the peeling of electroplated metal from a wafer, is disclosed. The apparatus includes a seed layer detector system having a light source and a reflectivity detector. According to the method, the light source emits a beam of light onto a wafer and the reflectivity detector receives the light reflected from the wafer. The reflectivity of the wafer surface is measured to determine the presence or absence of a seed layer on the wafer, as well as whether the seed layer has a minimum thickness for optimum electroplating of a metal onto the seed layer.

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