4. Adhesive bonding and miscellaneous chemical manufacture
  5. Differential fluid etching apparatus
  6. With microwave gas energizing means

Hozumi Yasuda

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Apparatus for and method of polishing workpiece

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent

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Apparatus for polishing a wafer

Abrading – Machine – Rotary tool
Patent

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Elastic membrane for semiconductor wafer polishing apparatus

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Design Patent

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Elastic membrane for semiconductor wafer polishing apparatus

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Design Patent

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Electrolytic processing apparatus and electrolytic...

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – Gap maintenance or defined tool-workpiece gap
Reexamination Certificate

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Profile ID: LFUS-PAI-P-576800

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