Electrolytic processing apparatus and electrolytic...

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – Gap maintenance or defined tool-workpiece gap

Reexamination Certificate

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Details

C205S654000, C204S198000, C204S22400M, C204S227000, C204S275100

Reexamination Certificate

active

07638030

ABSTRACT:
An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.

REFERENCES:
patent: 3883383 (1975-05-01), Leitz, Jr.
patent: 5258109 (1993-11-01), Vaughan
patent: 6368493 (2002-04-01), Mori et al.
patent: 6379223 (2002-04-01), Sun et al.
patent: 6440295 (2002-08-01), Wang
patent: 6602396 (2003-08-01), Mori et al.
patent: 6693036 (2004-02-01), Nogami et al.
patent: 6743349 (2004-06-01), Mori et al.
patent: 6875335 (2005-04-01), Mori et al.
patent: 7101465 (2006-09-01), Kobata et al.
patent: 7208076 (2007-04-01), Kobata et al.
patent: 1 029 954 (1999-09-01), None
patent: 1167585 (2002-01-01), None
patent: 00/34995 (2000-06-01), None
patent: 03/054255 (2003-07-01), None
patent: 03/064734 (2003-08-01), None
Co-pending U.S. Appl. No. 10/337,357, filed Jan. 7, 2003, entitled “Electrolytic Processing Device and Substrate Processing Apparatus”.
Co-pending U.S. Appl. No. 10/432,397, filed May 21, 2003, entitled “Method and Device for Regenerating Ion Exchanger, and Electrolytic Processing Apparatus”.
European Search Report issued Dec. 3, 2007 in a European Application which is a foreign counter part of the present application.

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