Abrading – Machine – Rotary tool
Patent
1996-04-01
1999-03-02
Eley, Timothy V.
Abrading
Machine
Rotary tool
451290, 451398, 451 41, B24B 2902
Patent
active
058762736
ABSTRACT:
A polishing apparatus is provided which improves uniformity across the surface of a polished wafer. The apparatus includes a wafer carrier, a guide ring coupled to a lower portion of the wafer carrier, a circular plate coupled to a first inner circumference portion of the guide ring distant from the wafer carrier, and a cavity, formed within an area bounded by the lower portion of the wafer carrier, an inner circumference of the circular plate, and a second inner circumference portion of the guide ring between the circular plate and the lower portion of the wafer carrier, the circular plate holding the wafer to be polished in the cavity.
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Kimura Norio
Okumura Katsuya
Yahiro Tomoyuki
Yano Hiroyuki
Yasuda Hozumi
Ebara Corporation
Eley Timothy V.
Kabushiki Kaisha Toshiba
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