4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Howard Lee Marks

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Flip chip semiconductor die internal signal access system...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

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Method of fabricating a pad over active circuit I.C. with...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Pad over active circuit system and method with frame support...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Pad over active circuit system and method with meshed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3139251

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