Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate
2004-02-27
2010-11-30
Smith, Zandra (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Test or calibration structure
C257S690000, C257S694000, C257S737000, C257S780000, C257SE23002
Reexamination Certificate
active
07842948
ABSTRACT:
A device and method for providing access to a signal of a flip chip semiconductor die. A hole is bored into a semiconductor die to a test probe point. The hole is backfilled with a conductive material, electrically coupling the test probe point to a signal redistribution layer. A conductive bump of the signal redistribution layer is electrically coupled to a conductive contact of a package substrate. An external access point of the package substrate is electrically coupled to the conductive contact, such that signals of the flip chip semiconductor die are accessible for measurement at the external access point.
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Marks Howard Lee
Schieck Brian S.
Duong Khanh B
NVIDIA Corporation
Smith Zandra
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