Method of fabricating a pad over active circuit I.C. with...

Details Method of fabricating a pad over active circuit I.C. with... Method of fabricating a pad over active circuit I.C. with...

2005-01-28

2008-09-30

Vu, Hung (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C438S618000, C438S622000

Reexamination Certificate

active

07429528

ABSTRACT:
An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer is meshed.

REFERENCES:
patent: 6100589 (2000-08-01), Tanaka
patent: 6707156 (2004-03-01), Suzuki et al.
Communication from Taiwanese application No. 93114432 which was mailed on Feb. 9, 2006.
Examiner's Answer from U.S. Appl. No. 11/067,551 which was mailed on Apr. 5, 2007.
Decision on Appeal from U.S. Appl. No. 10/633,004 which was mailed on Mar. 27, 2008.

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