4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Honjin En

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Manufacturing method of a multilayered printed circuit board...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method of manufacturing a multilayered printed circuit board

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method of manufacturing multilayered circuit board

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Multilayer build-up wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Multilayer build-up wiring board including a chip mount region

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – With housing or external electrode
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2608709

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