Method of manufacturing multilayered circuit board

Details Method of manufacturing multilayered circuit board Method of manufacturing multilayered circuit board

2003-02-03

2008-08-26

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C029S846000, C029S852000, C216S035000, C427S097200, C430S314000, C430S318000

Reexamination Certificate

active

07415761

ABSTRACT:
An opening is formed in resin20by a laser beam so that a via hole is formed. At this time, copper foil22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening20acan be formed in the resin20if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin20which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

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