Method of manufacturing a multilayered printed circuit board

Details Method of manufacturing a multilayered printed circuit board Method of manufacturing a multilayered printed circuit board

2008-04-07

2010-11-16

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S829000, C029S846000, C216S035000, C427S097200

Reexamination Certificate

active

07832098

ABSTRACT:
An opening is formed in resin20by a laser beam so that a via hole is formed. At this time, copper foil22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening20acan be formed in the resin20if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin20which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

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