4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Holger Huebner

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Apparatus and method for reactive ion etching

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent

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Method for contact-connecting a semiconductor component

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method for filling via holes in a semiconductor layer structure

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Method for manufacturing a three-dimensional circuit apparatus

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Method for producing a resist structure on a semiconductor

Fishing – trapping – and vermin destroying
Patent

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Profile ID: LFUS-PAI-P-426570

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