Method for manufacturing a three-dimensional circuit apparatus

Details Method for manufacturing a three-dimensional circuit apparatus Method for manufacturing a three-dimensional circuit apparatus

1994-01-25

1995-05-30

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437 78, 437 86, 437203, B44C 122, C03C 1500, C23F 100, H01L 21306

Patent

active

054198062

ABSTRACT:
A method for producing a three-dimensional circuit apparatus, wherein substrates that are arranged above one another are firmly joined to one another by depressions in the adjoining surfaces of the neighboring substrates. The depressions are filled with a mixture of two metal constituents, one being a liquid and the other being a solid and the solid constituent dissolves in the liquid constituent, which leads to the hardening of the mixture, and firmly joins the depressions to one another due to the hardening of the mixture. In addition, detached components are arranged on prepared substrate wafers and are firmly joined thereto.

REFERENCES:
patent: 4893174 (1990-01-01), Yamada et al.
patent: 4897708 (1990-01-01), Clements
patent: 5087585 (1992-02-01), Hayashi
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5336929 (1994-08-01), Hayashi
Three-dimensional ICs Project (Fiscal 1981-1990), Research and Development Association for Future Electronic Dev., FED, Tokyo, 1991, Chapter 2.1.
C. A. MacKay, Proc of the Techn. Conf., 9th Annual Int. Electronics Packaging Conf., IEPS, San Diego, Calif., USA, 1989, pp. 1244-1259.

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