Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Inventor
active
Deposition process for coating or filling re-entry shaped contac
Deposition process for coating or filling re-entry shaped contac
Integrated circuit structure having contact openings and vias fi
Method of filling of contact openings and vias by self-extrusion
Silicon-doped titanium wetting layer for aluminum plug
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Profile ID: LFUS-PAI-P-339944