Deposition process for coating or filling re-entry shaped contac

Details Deposition process for coating or filling re-entry shaped contac Deposition process for coating or filling re-entry shaped contac

1998-01-28

2000-03-07

McDonald, Rodney G.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429809, 20429811, 20429806, 20419213, C23C 1434

Patent

active

060335416

ABSTRACT:
A method and apparatus for depositing material to conformally cover or fill holes within the surface of a semiconductor substrate. The preferred method includes the steps of coherently depositing a first thickness of the material onto the surface of the substrate; reverse sputtering the deposited material so as to coat the sidewalls of the contact holes with the deposited material; after the first thickness of the material is deposited onto the surface of the substrate, depositing a second thickness of the material onto the surface of the substrate; and while depositing the second thickness of the material onto the surface of the substrate, heating the substrate to enhance reflow of the material being deposited.

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