4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Julio Aranovich

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Integrated circuit structure having contact openings and vias fi

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Method of filling of contact openings and vias by self-extrusion

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Semiconductor processing system with a thermoelectric cooling/he

Refrigeration – Using electrical or magnetic effect – Thermoelectric; e.g. – peltier effect
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Profile ID: LFUS-PAI-P-339945

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