Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
Inventor
active
Encapsulation method
Epoxy resin composition for molding having improved mechanical p
Epoxy resin composition for sealing semiconductor
Method of manufacturing a semiconductor device sealed with moldi
Molded products for high voltage apparatus comprising brominated
No associations
LandOfFree
Hirozoh Kanegae does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Hirozoh Kanegae, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hirozoh Kanegae will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-84925