Encapsulation method

Details Encapsulation method Encapsulation method

1996-03-04

1998-08-25

Ortiz, Angela Y.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

264276, 264DIG50, 425116, 425DIG19, 425DIG47, B29C 3324, B29C 7070

Patent

active

057980705

ABSTRACT:
A molding machine comprises a mold composed of lower and upper mold sections. A recess is defined in the lower mold section to receive a lead frame or other objects. The lead frame is sandwiched between the upper and lower mold sections. A mold cavity is defined in the lower mold section below the recess so as to receive a thermosetting resin or encapsulant. A gasket groove is defined adjacent to the mold cavity to receive a gasket. The gasket is subject to plastic deformation upon application of force. An oil chamber is communicated with the gasket groove and contains hydraulic oil. The hydraulic oil is pressurized to urge the gasket against the lead frame. As a result, the gasket is so deformed as to closely contact the surface of the lead frame and seal the mold cavity. The hydraulic oil is preferably mixed with thermoplastic resin in powder form.

REFERENCES:
patent: 2326381 (1943-08-01), Milligan et al.
patent: 2615411 (1952-10-01), Clevenger et al.
patent: 3200442 (1965-08-01), Haller
patent: 3398222 (1968-08-01), Kaufman, Jr. et al.
patent: 4626185 (1986-12-01), Monnet
patent: 4732553 (1988-03-01), Hofer
patent: 4952135 (1990-08-01), Douglas
patent: 5061429 (1991-10-01), Yoshihara et al.
patent: 5118271 (1992-06-01), Baird et al.
patent: 5122320 (1992-06-01), Masui et al.
patent: 5151276 (1992-09-01), Sato et al.
patent: 5268183 (1993-12-01), Garza
patent: 5391333 (1995-02-01), Stecher et al.
patent: 5395226 (1995-03-01), Sakai et al.

Affiliated with

Also associated with

Rating

Encapsulation method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-34317