Epoxy resin composition for molding having improved mechanical p

Details Epoxy resin composition for molding having improved mechanical p Epoxy resin composition for molding having improved mechanical p

1997-04-30

1999-08-17

Wilson, Donald R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523435, 523443, 523466, 528102, C08L 6302

Patent

active

059394722

ABSTRACT:
Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

REFERENCES:
patent: 3268619 (1966-08-01), Nametz
patent: 3388098 (1968-06-01), Harding
patent: 3635843 (1972-01-01), Parry et al.
patent: 4042550 (1977-08-01), Tuller et al.
patent: 4202811 (1980-05-01), Michael et al.
patent: 4271061 (1981-06-01), Suzuki et al.
patent: 4532308 (1985-07-01), Sato et al.
patent: 4617330 (1986-10-01), Thai et al.
patent: 4656294 (1987-04-01), Kanayama
patent: 4687832 (1987-08-01), Ehara et al.
patent: 5137940 (1992-08-01), Tomiyoshi
Ochi et al., Polymer, vol. 27, pp. 1569-1573 (1986).
JP03-009,920 Abstract, World Patents Index #91-061419, STN International, Columbus, OH (1991).
JP04-337,317 Abstract, World Patent Index #93-011636, STN International, Columbus, OH (1993).

Affiliated with

Also associated with

Rating

Epoxy resin composition for molding having improved mechanical p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin composition for molding having improved mechanical p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition for molding having improved mechanical p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-315302