Epoxy resin composition for molding having improved mechanical p

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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Details

Other Related Categories

523435, 523443, 523466, 528102, C08L 6302

Type

Patent

Status

active

Patent number

059394722

Description

ABSTRACT:
Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

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Ochi et al., Polymer, vol. 27, pp. 1569-1573 (1986).
JP03-009,920 Abstract, World Patents Index #91-061419, STN International, Columbus, OH (1991).
JP04-337,317 Abstract, World Patent Index #93-011636, STN International, Columbus, OH (1993).

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