Epoxy resin composition for sealing semiconductor

Details Epoxy resin composition for sealing semiconductor Epoxy resin composition for sealing semiconductor

1991-03-18

1992-05-19

Morgan, Kriellion S.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523435, 523476, C08L 8304, C08L 6300

Patent

active

051149940

ABSTRACT:
Disclosed herein is an epoxy resin composition for sealing a semiconductor, which contains a flexibilizer, epoxy resin, a hardener, a hardening accelerator, a filler, a mold releasing agent, a colorant and a finishing agent. The flexibilizer is prepared from silicone containing hydroxyphenyl groups on ends of and/or in its molecules, which is formed of a copolymer of denatured silicone oil A having hydroxyphenyl groups, denatured silicone oil B having epoxy groups and/or bifunctional epoxy resin having epoxy groups on both ends.
In addition to heat resistance, moisture resistance, a low elastic modulus, a low thermal expansion coefficient and a high glass-transition temperature, the epoxy resin composition according to the present invention has toughness which is higher than that of a conventional one, due to fine dispersion of silicone.

REFERENCES:
patent: 4624998 (1986-11-01), Keil
patent: 4701482 (1987-10-01), Itoh et al.
patent: 4720515 (1988-01-01), Iji et al.
patent: 5034436 (1991-07-01), Takahashi et al.

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