4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Hidetoshi Kusano

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Electronic parts mounting board and production method thereof

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Fabrication method of wiring substrate for mounting...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Fabrication method of wiring substrate for mounting...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Flexible multilayer wiring board and manufacture method thereof

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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High-frequency coil device and method of manufacturing the same

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1816325

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