Flexible multilayer wiring board and manufacture method thereof

Details Flexible multilayer wiring board and manufacture method thereof Flexible multilayer wiring board and manufacture method thereof

2006-10-03

2006-10-03

Patel, Ishwar (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S267000, C361S792000

Reexamination Certificate

active

07115818

ABSTRACT:
Metal foil is laminated via an insulating layer so as to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed so as to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in interlayer via holes each formed by applying a laser beam to the resist layer, thereby to establish interlayer connection between the first layer circuit wiring and the second layer circuit wiring. Subsequently, the resist layer is removed, and then, using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in hole portions of an insulating layer formed so as to cover the second layer circuit wiring, thereby to form external connection terminals. Then, the conductive substrate is removed entirely or partly to expose the first layer circuit wiring, thereby to manufacture a flexible multilayer wiring board.

REFERENCES:
patent: 6310304 (2001-10-01), Hayama et al.
patent: 6329610 (2001-12-01), Takubo et al.
patent: 6351031 (2002-02-01), Iijima et al.
patent: 6399891 (2002-06-01), Kurita et al.
patent: 6441314 (2002-08-01), Rokugawa et al.
patent: 9-246445 (1997-09-01), None
patent: 02001308533 (2001-11-01), None
Computer translation of Japanese Patent No. JP02001308533A.

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