High-frequency coil device and method of manufacturing the same

Details High-frequency coil device and method of manufacturing the same High-frequency coil device and method of manufacturing the same

2005-09-06

2005-09-06

Nguyen, Tuyen T (Department: 2832)

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

C336S232000

Reexamination Certificate

active

06940385

ABSTRACT:
In a high-frequency coil device having small dispersion in coil inductance and suitable for use in GHz band and a method of manufacturing the high-frequency coil device, a spirally-shaped fine-pitch coil is embedded in the surface of a polyimide layer as a dielectric substrate so that the bottom surface and side surface of the coil is covered by the polyimide layer. The spirally-shaped coil has an Ni—Cu laminate structure in which an Ni plating layer and a Cu plating layer are laminated, and also the side surface thereof is made substantially vertical while the width thereof is uniform with high precision. The surface of the spirally-shaped coil, that is, the surface of the Ni plating layer serving as the upper layer is coated with an Au plating layer.

REFERENCES:
patent: 5111169 (1992-05-01), Ikeda
patent: 5477204 (1995-12-01), Li
patent: 6356183 (2002-03-01), Jou

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