4. Metal fusion bonding
  5. With means to juxtapose and bond plural workpieces
  6. Plural discrete workpieces

Hee Kook Choi

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Die bonding apparatus with a revolving pick-up tool

Metal working – Means to assemble or disassemble – Means to assemble electrical device
Patent

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Die collet for a semiconductor chip and apparatus for...

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Reexamination Certificate

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Double-sided circuit board and multi-chip package including...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Method for manufacturing a semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Mold for semiconductor packages

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent

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Profile ID: LFUS-PAI-P-1468611

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