Die bonding apparatus with a revolving pick-up tool

Details Die bonding apparatus with a revolving pick-up tool Die bonding apparatus with a revolving pick-up tool

1996-09-30

1998-06-16

Vo, Peter

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29740, 29827, 29DIG44, 228 62, 294 641, 414737, 414752, 414941, 437220, H05K 1304, H01L 2158, H01L 2160

Patent

active

057652775

ABSTRACT:
A die bonding apparatus for separating a chip from a tested wafer including a plurality of chips and attaching the chip to a lead frame comprising a chip-transferring part for separating the chip from the wafer and transferring the chip to a place where a lead frame is prepared for die bonding; a stage where the transferred chip is placed; a bond head for compressing the chip and the lead frame to bond them together; and a lead frame-transferring part for transferring the lead frame to a predetermined place, the chip-transferring part being comprised of a first rectilinearly moving picking tool and a second revolving picking tool.

REFERENCES:
patent: 3604108 (1971-09-01), Mallery
patent: 5197650 (1993-03-01), Monzen et al.
patent: 5516026 (1996-05-01), Ariye et al.
patent: 5579980 (1996-12-01), Ichikawa

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