4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Hee-Jin Park

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BGA semiconductor chip package and mounting structure thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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BGA semiconductor chip package and mounting structure thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Method for providing banking services by use of mobile...

Registers – Systems controlled by data bearing records – Banking systems
Reexamination Certificate

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Semiconductor package, memory card including the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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Stacked chip package with heat transfer wires

Heat exchange – Heat transmitter
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2395844

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