Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2005-11-23
2009-12-08
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257S787000, C257S701000
Reexamination Certificate
active
07629679
ABSTRACT:
A semiconductor package includes a printed circuit board, a semiconductor chip mounted on the printed circuit board, a wire structured to electrically connect the printed circuit board to the semiconductor chip, and an encapsulant that protects the semiconductor chip and the wire, the encapsulant disposed on the printed circuit board such that the encapsulant covers a surface of the printed in an edge region of the printed circuit board and exposes another surface of the printed circuit board in another edge region of the printed circuit board.
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English language abstract of Korean Publication No. 2002-7576.
English language abstract of Japanese Publication No. 2002-015296.
Clark S. V
Samsung Electronics Co,. Ltd.
Volentine & Whitt PLLC
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