Stacked chip package with heat transfer wires

Details Stacked chip package with heat transfer wires Stacked chip package with heat transfer wires

2005-02-22

2005-02-22

Duong, Tho V (Department: 3743)

Heat exchange

Heat transmitter

C257S777000, C438S122000

Reexamination Certificate

active

06857470

ABSTRACT:
The present invention provides a stacked chip package having at least one heat transfer wire. The heat transfer wire is disposed between the stacked chips and at least one end of each transfer wire is connected to a dummy pad provided on the board. Therefore, the heat generated by the chips and trapped between the chips can be effectively dissipated. The heat transfer wires can be formed on the uppermost chip of the stacked chips to enhance the heat dissipation. In addition, by controlling the number or the size of the heat transfer wire, the thermal characteristics of the stacked chip package can be modified.

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patent: 6784023 (2004-08-01), Ball
patent: 2002-36191 (2002-05-01), None
patent: 2002-43395 (2002-06-01), None
English language of Korean Abstract for Korean Patent Publication No. 2002-43395 published Jun. 10, 2002.
English language of Korean Abstract for Korean Patent Publication No.2002-36191, published May 16, 2002.

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