4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Insulative housing or support

Hans-Jürgen Hacke

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Electronic chip component with an integrated circuit and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – By pressure alone
Reexamination Certificate

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Electronic component including a housing and a substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Electronic device having microscopically small contact areas...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Method for manufacturing integrated circuits and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Method for producing a semiconductor device in chip format

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2597953

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