Electronic component including a housing and a substrate

Details Electronic component including a housing and a substrate Electronic component including a housing and a substrate

2005-08-16

2005-08-16

Schillinger, Laura M (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S703000, C257S690000

Reexamination Certificate

active

06930383

ABSTRACT:
The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.

REFERENCES:
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Brockhaus Conversations-Lexikon [Brockhaus Conversation Lexicon], Ed. 13, vol. 16, p. 665, 1887.
Winacker et al.: “Chemische Technologie” [Chemical Technology], Carl Hanser Verlag München, Ed. 4, vol. 3, 1983, pp. 435, 436, and 461.

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